A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: Re: Metal Adhesion
Re: Metal Adhesion
1996-07-15
Alexander Holke
Re: Metal Adhesion
Alexander Holke
1996-07-15
We use Cr as an adhesion layer, as stated before. When we etched in
KOH afterwards we found a lot of bubbles in the metal layer. This
improved a lot after after "sintering" at 300 deg C for a couple of
minutes under Nitrogen. We believe the Cr-layer "eats up" some of
the oxide. Maybe it also works with Titanium.

Alexander Hoelke
Graduate Student Electrical Engeneering
University of Cincinnati
MEMS Group
e-mail aholke@uceng.uc.edu


reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
Harrick Plasma, Inc.
MEMS Technology Review
Process Variations in Microsystems Manufacturing
University Wafer