Hi Bob:
Try the commercially available AZ3312 of 6 um. There
are others, too. We are quite successful with it.
Cheers,
Thomas

 --- BobHendu@aol.com schrieb: > We have recently
begun processing wafers using a new
> plasma system for doing
> deep silicon etch. Since our goal is 100 microns of
> vertical etch profile in
> silicon we are interested in what types of positive
> photoresists MEMS people
> are using. Our initial results with standard
> positive resist at thicknesses
> of around 1.2 microns have not yielded very
> consistant results. Work that we
> have done with SU-8 resist have been very good with
> respect to profile and
> depth of etch using a formulation of around 5
> microns thickness. This also
> allows us to ash off the SU-8 after etch with little
> problem. My question is
> what type of resists are acceptable within the MEMS
> community that will yield
> at least a 4-5 micron thickness with vertical
> profiles using stepper or other
> alignment tools. Bob Henderson
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