Yes, you can do it.  You need to make alignment marks on both sides of
the wafer (this you can do it by making a jig which has masks with
alignment marks only for both sides of the wafer).  After patterning the
wafer for alignment marks (si etch), reoxidize the wafer.  Now both
sides of the wafer can be individually processed as long as you have
same (or complimentary) alignment marks for the rest of your processes.

Vikas Gupta
TiNi Alloy Company


> Dear Mems group,
>
> I have a single side mask aligner.  Is there a method by which this aligner
> can be used to align features on both sides of the wafer?
>
> Thanks for your assistance.
>
> Marty
>
> Martin O. Patton
> Senior Research Engineer
> Essential Research Incorporated
> 6410 Eastland Road
> Cleveland, Ohio 44142
> www.er.com
> (440) 816-9850
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