zhuxiaorui

You may not be able to fusion bond a silicon wafer to a polysilicon surface
due to
grain roughness. Try doing an AFM measurement of 10x10 micron area, if your
roughness comes in at less than 0.50 nm you may have a chance if your Z
height isn't too high. If too rough you can try doing a CMP polish but that
will only help to a certain degree as the grain boundaries will
preferentially etch.

Maurice H. Norcott
Senior Technician
Silicon Genesis Corporation
590 Division Street
Campbell, CA 95008

408-871-3948 Office
408-977-6333 Pager
[email protected]



 -----Original Message-----
From: zhuxiaorui [mailto:[email protected]]
Sent: Thursday, February 21, 2002 3:21 AM
To: [email protected]
Subject: [mems-talk] about polysilicon bonding


Hello,friends

Does anyone know about how to bond polysilicon layer and silicon wafer?
I will appreciate if anyone gives me some advice.

Thanks,
Zhu Xiaorui

            zhuxiaorui
            [email protected]
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