Hi Manoj,

Its great to know that SCL, India is planning to setup a MEMS fab.  This
should help in promoting MEMS awareness in India.

Regarding your question about DRIE V/S Wet etch,  I would strongly advise
you to go in for DRIE.  The main reason is high aspect ratio requirement in
MEMS products.  Wet etch is ok in some of the common MEMS products like
pressure sensors and accelerometers. But majority of the present day
products in optical MEMS, bio mems and other areas need  deep silicon
etching with vertical side walls. Also many products might require circular
holes through the wafer which again require DRIE.

 In my opinion a good MEMS fab should have DRIE and wafer bonding
capabilities apart from the standard processes.

Good luck in your endeavor

Suresh   Sampath
Process Engineer

Innovative Micro Technology
75 Robin Hill Road * Santa Barbara, CA  93117
Ph:  805-681-2896 * Fx:  805-967-2677
[email protected]   * www.imtmems.com


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