All three are options!

-Mike


>>> rogerbr@earthlink.net 02/23/02 05:05AM >>>
Hi everybody!

I'm now wet etching to make through holes in 12 mil (305 microns) <100>
Si.
 The desired hole size is about 10 mils by 30 mils  (254 microns by 762

microns).

Is laser or physical drilling a possible alternative?

How about deep RIE?

Thanks.


Roger Brennan
Home:
1403 Forrestal Avenue
San Jose, CA 95110
(408)453-0711 (telephone)
(408)573-9407 (fax)
rogerbr@earthlink.net

Work:
Endevco
355 N. Pastoria Ave.
Sunnyvale, CA 94085
408-739-3533 ext 204
roger.brennan@endevco.com
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