Hi Hongjun,
    To avoid adhesion layers, you can use energetic ion deposition.
Using this technique you can definitely put Au on glass without an
adhesion layer and it passes tape tests. To use the technique
inexpensively you can buy a conversion kit for your 4" sputterer from
Skion Corp in NJ, www.skion.com, for about $10k. The conversion kit is
essentially a thermally controlled Cs source. The idea is that the Cs,
which has a very low work function, redilly gives up electrons to the
metal source to produce negative ions that are given kinetic energy via
either the plasma potential or an externally applied field.

-Mike


>>> [email protected] 03/05/02 06:03PM >>>
Dear all,

I'm trying to fabricate platinum electrodes on glass or silicon
wafers.
Originally, adopting Ti or Cr as adhesion layer can improve the
adhesion of
platinum on the substrate, but now my electrodes will be used for
electroanalysis and don't want any active metal. So,

1. Is there any method to deposit platinum directly on glass or silicon
with
enough adhesion?

2. Or, if without platinum electrode, is there any other material which
is
chemically stable enough  patterned on Si or glass to electrolyze
water.

Thanks a lot,

Hongjun Zeng
Microfabrication Applications Laboratory (MAL)
University of Illinois at Chicago
ERF Building, 842 W. Taylor Street
Chicago, IL 60607-7022
Room 3014 ERF
Tel.: 312-413-5889, Fax: 312-996-6465
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