Dear fellow MEMS researchers,

I would like to get an overview of wafer bonding techniques.
I am especially interested to know which materials can be bonded
together by which bonding techniques and what advantages and dis-
advantages there are. Also, which equipment manufacturers there
are. I would be grateful if somebody can point me to good sources
of information or literature.

Thanks and have a nice day,
        Frank Berauer
        Senior R&D Engineer
        Hewlett-Packard Singapore