>
> Dear colleagues,
>
> I am trying to isotropically etch glass wafers. I want to etch the mask
> directly, but after etch in 1:1 BOE/HF, I found that the Cr was lift off
> and etched away, and the lateral etch rate is much higher than vertical.
> I don't understand why is that, maybe because the etching of Cr, but accord-
> ing to CRC hand book, Cr should be able to stand for HF. Is there anyone did
> the similar process? How can I get good isotropic etching of glass wafer?
> Any suggestions and explanations are highly appreciated. Thanks a lot.
>
> Ingrid Y. Xu
> Microfabrication and Application Lab
> The University of Illinois at Chicago
> TEL: (312)-413-7576
>
>
>