Hi,

I would like to suggest that you try Ti first, then try TiN second,
lastly if the first 2 fail I would try Ta, I do not think the Cr will
last at 600c.

I assume that you can etch the Pt with an ion beam etch tool, if so that
will also etch the adhesion layers. If you are wet etching the Pt in
(HCL/Nitric mixtures) the TiN maybe the best choice. Be careful because
Ti and Ta are etched in HF Acid mixtures.

Rick Morrison
[email protected]

Jvrn Koblitz wrote:

>Dear MEMS-talk members,
>
>I am looking for a suitable adhesion layer between an LPCVD SiN
>substrate layer and a 0.5 micron thick platinum layer (used as bond
>pads) that is stable up to 600 deg. C.
>Ideally, we would use the Pt without any adhesion layer, but I fear that
>long-term stability/reliability could be an issue then. We apply
>sputtering of the Pt and do have tantalum, titanium, TiN and Cr targets
>in use with our sputtering machine.
>Can anyone propose a suitable solution or even process?
>
>Many thanks in advance.
>
>Joern Koblitz
>microFAB Bremen GmbH
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