We have been working on that technology, we can change the differential
thermal expansion to match.  We are prototyping silicon carbide package or
surface mount board with a "quartz-like" glass frit.
Rob Davis
Scientist
Caldus Semiconductor
Richland Washington
1-509-375-4775

-----Original Message-----
From: [email protected] [mailto:[email protected]]On
Behalf Of Paolo Bondavalli
Sent: Thursday, March 14, 2002 7:59 AM
To: [email protected]
Subject: [mems-talk] GLASS FRIT


Dear Mems Experts
We are tried to use glas frit in order to realize hermetic packaging of
MEMS.
Could you give me more information about this technique?
The cure temperature, the principal suppliers, publications about it...
Thanks a lot
have a nice day.

*********************************************************
Dr. Paolo Bondavalli
R&D Engineer
LABCOM - Laboratoire Interconnexions Optiques et MEMS
THALES (ex THOMSON-CSF) CORPORATE RESEARCH CENTER
Domaine de Corbeville,
Route Departementale 128
F91404 ORSAY
(FRANCE)
Tel : 01 69 33 08 63
Fax : 01 69 33 08 62
Email : [email protected]
**********************************************************
Disclaimer: Opinions expressed herein are my own and may
  not represent those of my employer.
**********************************************************
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