We are still accepting abstracts until April 5 for the MEMS/Nanotechnology
joint symposium at this year's International Mechanical Engineering Congress
and Exposition in New Orleans, LA.  Please see http://www.asme.org/congress
for more details.

Microelectromechanical Systems Subdivision
MEMS and Nanotechnology Symposium
A joint collaboration between the MEMS subdivision, and the Advanced Energy
Systems, Aerospace, Applied Mechanics, Bioengineering, Electronics and
Photonics Packaging, Fluids Engineering, Heat Transfer, Manufacturing
Engineering, Materials, and Non-Destructive Evaluation Engineering Divisions


The goal of this symposium is to bring together the best work from the many
areas of research in MEMS and Nano Technologies. It is the ideal forum to
exchange ideas and technologies in these rapidly evolving multidisciplinary
fields. This year ten different ASME divisions are jointly sponsoring MEMS
sessions, which are typically attended by hundreds of attendees from all
areas of ASME. All contributions are published together in a single volume.

Last year we were in "The Big Apple." This year, it's "The Big Easy" - New
Orleans. The conference will be held at the New Orleans Hilton Hotel and the
Ernest Morial Convention Center. Papers addressing nanotechnology topics are
highly encouraged as ASME establishes its leadership role in this
revolutionary new field. A poster session will be held not only to
accommodate the growing number of quality papers, but also to provide a
platform for demonstrations and one-on-one interactions.

The purpose of the symposia is to provide a means of reporting the latest
developments on MEMS for a wide range of applications. Topics of interest
include, but are not limited to:

*    Adaptive materials/structures for MEMS
*    Design methodology, modeling and simulation techniques, and
characterization of micro/nano scale devices
*    Physics and mechanics of nanotechnology and nanodevices
*    Integration, modeling, and experiments of nanodevices on MEMS
*    Aspects of micro and nano machining and related processing and
tolerance
*    Metrology and analytical techniques for nanotechnology
*    Novel processes and tools for unique nano and micro structures
*    Fundamental micro-scale issues including structures, dynamics,
tribology, fluidics, heat transfer, and surface physics
*    Wafer level, or hybrid packaging of MEMS; packaging for RF, optical,
and Bio-MEMS
*    Micro-sensors for acceleration, pressure, force, strain, temperature,
flow, or bio-systems
*    Micro-actuators based on electrostatic, electromagnetic,
thermomechanical, thermochemical, phase transition (and other smart
materials), and hydraulic phenomena
*    Micro-systems including micro-robotics, Total Analytical Systems for
biochemical assays, and MEMS-based power sources
*    Fluidic devices and systems including valves, flow control,
microdosing, mixing, filtering, cytometry, or pumping
*    Fundamental science of microfluidic transport of gases, liquids,
complex fluids, biological materials, or flows containing particulates
*    Microflow measurement techniques including flow visualization and
sensing of flow properties
*    MEMS for Minimally-Invasive Surgery, drug delivery systems, and micro
implantable devices
*    Micro/Nanofabricated tissue constructs, Biomimetic Substrates and
Protein-substrate interactions
*    Rapid prototyping of BioMEMS devices


An award for the "Best Student Paper" will be presented during the
conference to encourage young MEMS protigis. Please indicate in your
submission whether the first author is a student so that it can be entered
into the selection process for this award.

Abstracts will be peer reviewed. Authors notified of acceptance will prepare
manuscripts from four to eight pages in length formatted according to ASME
standards. Author kits and writer's guidelines are available online at
http://www.asme.org/pubs/authors/index.html. Author kits will also be sent
to authors whose abstracts are accepted in time for preparation of the final
manuscript. Final manuscripts will be published in CD-ROM proceedings
available at the meeting.

The MEMS subdivision invites interested parties to join ASME and the
Microelectromechanical Systems Subdivision. Membership information is
available at http://www.asme.org/memb/. Specific information about the new
ASME Subdivision of MEMS may be found at
http://www.asme.org/divisions/mems/.

Schedule
Abstracts due by email ONLY (PDF format)     Friday, March 1, 2002
(EXTENDED TO APRIL 5)
Authors notified of abstract acceptance     May 15, 2002
Electronic manuscript submission     (no later than) August 1, 2002

Abstracts

Prospective authors are asked to submit electronic versions (PDF format) of
a 600 word abstract (plus 1 page of figures) to Prof. Kimberly Turner -
[email protected]. The abstract should have a heading that
includes the title, authors with communicating author underlined, word
count, and the following information for the communicating author:
affiliation, mailing address, telephone, FAX numbers and e-mail address. The
abstract must describe results already achieved, not proposed goals.
Prospective authors may indicate preference for poster or oral sessions.
Authors may also indicate a sponsoring division's area of expertise most
relevant to their topic.

Sponsoring Organizers

Please feel free to contact any of the sponsoring organizers below for
additional information, however all abstracts should be sent to Prof.
Turner.

MEMS: Prof. Kimberly Turner, University of California, Santa Barbara, (805)
893-5106, [email protected], or Dr. Jonathan Simon, Agilent
Laboratories, (650) 485-2608, [email protected]

Micro-Fluidics: Prof. Kenny Breuer, Brown University, (401) 863-2870,
[email protected].

Medical Applications of Microsystems: Prof. Rob Keynton, University of
Louisville, (502) 852-6356, [email protected]

MEMS Packaging: Prof. Shaochen Chen, University of Texas at Austin, (512)
232-6094, [email protected]

Manufacturing of MEMS, and Related Micro and Nano Systems: Prof. Ajay P.
Malshe, University of Arkansas, (501) 575-6561, [email protected]

Advanced Energy Systems: Prof. Richard B. Peterson, Oregon State University,
(541) 737-7095, [email protected]

Aerospace: Prof. Martin Dunn, University of Colorado, Boulder, (303)
492-6542, [email protected]

Heat Transfer: Prof. Ken Goodson, Stanford University, (650) 725-2086 ,
[email protected]

Non-Destructive Evaluation: Prof. Cetin Cetinkaya, Clarkson University,
(315) 268-6514, [email protected]

Electronics Materials: Dr. Qing Ma, Intel, (408)765-2116, [email protected],
or Prof. Gabriel M. Rebeiz, University of Michigan, (734) 647-1793,
[email protected]

Modeling and Experiments on Micro/Nano systems: Prof. Junghoon Lee,
Northwestern University, (847) 491-2743, [email protected]