> I have a 300A Cr/2500A Au delamination problem. Cr/Au
> was deposited on p-type Si <100> wafer. Then it was
> put into concentrated HF and Cr/Au layer were peeled off
> after 30 minutes. The pre-clean (RCA clean and a 2min

   HF will etch chromium - try a 40-50A adhesion layer, I've used that
for over 20 minute etches in 49% (conc.) HF with no delamination
problems.

John Maloney
MEMS Engineer
MicroCHIPS, Inc.
http://mchips.com