Dear folks,

Thank you for your warm help. Here are some detailed
 information of the etching:
1. The etching was in room temp, no agitation;
2. I did a 90s 2% HF dip before sputtering;
3. I tried 100ACr/2500AAu and 300Cr/8000A Au also, but
delamination also occured; The stress measuremnts
 shows the deposition thickness is correct;
4. I did type test before immersion into HF, Cr/Au
 layer adhered to Si substrate pretty well; didn't
found pin holes or porous structure from SEM pictures;

Now the only thing is Cr got etched in concentrated
HF. But the observation is the backside of the
delamination layer is silver (Cr color). If the
etching rate of Cr is so fast, why the so thin Cr
layer still left? Tommorrow I'll try to measure the
etch rate of Cr. Thanks again.

Jiang
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