Hi,

Cr depositions are usually high stress, I would think that at 3000A the
stress was very high, did you measure the stress?


How did you clean the wafers? they are never clean when you get them
from the supplier, usually you do a version of the RCA clean before
deposition.

Rick


Soojin Oh wrote:

>3000A Cr was deposited by thermal evaporation on top
>of SiO2 surface, and kept on table top for 3 month. Cr
>layer peels off when DI water is squirted onto the
>surface from wherever water touches. Can you suggest
>any possible causes? Contact surface was supposedly
>clean because I handed new clean wafers to this person
>who did evaporation, but I don't know what kind of
>effort was made to clean them further. Cr layer was ok
>right after deposition, 3 month ago.
>Thank you.
>
>-Soojin
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