Hello Jun,
If I understand you correctly, you want to know displacements for two different
systems. The first is a bimetallic strip, or thermal bimorph transducer; and the
second is a cantilever with an electrostatic load.
You can find the information that you want to know about thermal bimorph
transducers on page 555 of the "Micromachined Transducers Sourcebook", by Greg
Kovacs. This book is an excellent starting point for answering many questions
about MEMS.
The deflection of a cantilever under electrostatic load was first calculated by
Kurt Petersen in "Dynamic Micromechanics on Silicon". Petersen's model has been
refined by Peter Osterberg in his dissertation, ""Electrostatically Actuated
Microelectromechanical Test Structures for Material Property Measurement". You
will also find articles covering this material by Osterberg and Senturia.
Lastly, both of the problems that you describe are, at their core, problems in
static mechanics. My favorite text on this topic is Roy Craig, "Mechanics of
Materials".
Best Wishes for All Your Work,
Craig McGray
6211 Sudikoff Laboratory
Dartmouth College
Hanover, NH 03755
[email protected] wrote:
> Date: Wed, 10 Apr 2002 06:45:20 -0700 (PDT)
> From: Jun yao
>
> Hi, dear all,
> Electrostatic actuators are becoming more and more important in MEMS
because they can generate the great force to manipulate the micro structures
(for example, turning switches). However, it seems that not much theoretic
researches have been developed on this field, especially theoretic analysis
works.
>
> I am interested in the following phenomena: applying a voltage on a thin
film heater (which is deposited on Silicon beam), voltage generates current,
heating should be caused by the current, then the silicon beam bends to one
direction because of Expansion Coefficient difference between the metal heater
and silicon material. Displacement of the beam is what I want to know.
>
> The parallel capacitor, its size is in micron order, is another
interesting structure to be analysed. Fix the left-end of the up-plate and fix
the down-plate at the same time, when I apply a voltage to the capacitor, the
right-end of up-plate will be bent (moves close to down-plate). Simply in one
sentence, firstly applying a voltage then a displacement generated. Again,
displacement of the up-plate is what I want to know. Are there any literatures
about the phenomenon by considering the properties of material?
>
> I hope that I state my questions clearly. Would you please provide me any
information on my questions? Would you please tell me some websites, books or
papers (some mathematical analysis in them) on the microstructures mentioned
above? Any helps and discussions on this matter with me will be highly
appreciated.
>
> Thank you very much.
>
> Jun Yao