First you need to answer some questions,
What is the plating seed metal?
Is it on the sidewall?
What is your current density?
What is your plating mask, resist or something else?

Rick





Xuchun Liu wrote:

>Hi, Everyone,
>
>I met a problem with Cu electroplating, hopefully
>someone can provide me some advice.
>
>The problem is, I want to fill a trench by Cu
>electroplating with DC. The size of trench is 10um x
>100um. The depth is 5um. Once I begin the plate, it
>seems that Cu is growing along the sidewall instead of
>filling the trench. I notice that if I grow in trench
>for 1um, Cu will accumulate in the sidewall for about
>3um above the surface. I wonder if anyone also has
>such a problem and what is the answer to this. Someone
>suggest me to do it by AC with some duty cycle, does
>this method avoid this problem? Usually what is the
>parameter for AC plating in the similar case?
>
>Thank you very much and hope someone can give me some
>solutiong soon!
>
>Bert Liu
>Yahoo! Tax Center - online filing with TurboTax
>http://taxes.yahoo.com/
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