>I have developed a problem with our Sputterer recently, that has me
>frustrated.
>I have an MRC 943 with a DC Magnetron Cathode. I'm using it to sputter 2
>microns of aluminum on Pyrex substrates. This process has been stable for
>years, but suddenly my substrates are bowed and very hot to the touch when
>they come out of the Sputterer.


9 kW is enough to heat any substrate unless it's coupled to a heat sink.

Has something changed in your substrate clamping or it's thermal
connection?
Another possibility is that you're introducing more heat to the
substrate. Secondary electrons is the primary heat source, so
any change in the grounding of shielding parts or the substrate
itself could have re-directed electrons.

If you need your hardware checked, KDF (www.kdf.com) have taken

over this product line from MRC.


good luck

klaus
--
                        (TEEL)          Tokyo Electron Europe Limited
                                        PVD Process Support  (ex MRC)
Klaus Beschorner                                   Tel +49-7033-45683
Drosselweg 6                                       Fax +49-7033-45631
71120 Grafenau, Germany                       Mobile +49-174 315 7754