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Consider your requirements for the dimensions, requirements for a mirror may
depend on the wave length you are reflecting, note that using a glass frit you
will need to deal with the porosity and also consider the thermal properties of
the materials....you will need to process at an elevated temperature....
Rob

>----- Original Message -----
>From: =?iso-8859-1?q?sou=20zou?=
>
>To: [email protected]
>Sent: Wed, 15 May 2002 +0200 (CEST) 09:28:39
>
>I am looking towards designing some MEMS devices
>(esp. torsional
>Micro-mirrors) using Hybrid flip chip technology.
>My concern is that I am
>still thinking about wheather I should use silicion
>on glass (Pyrex) or
>SI-to-SI bonding. Could you, please, help with
>advices such that the
>drawbacks and the advantages of every assembly, and
>how they could affect
>the properties of the components and their
>integration density ?
>
>Thank you everyone,
>
>Sofiane Zairi
>
>
>
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>-talk