hi wei liang
I am using MF series developer which is MFCD-26
in which dilution is not required.I think you can try without dilutions.
regards
sukanta
On Wed, 15 May 2002, it was written:
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> Today's Topics:
>
> 1. Help about MF-319 developer (Wei Liang)
> 2. Re: characterisation of multilayers (Michael D Martin)
> 3. Si-to-Glass or Si-to-Si wafer bonding (=?iso-8859-1?q?sou=20zou?=)
> 4. mechanical solver (=?iso-8859-1?q?sou=20zou?=)
> 5. SU8 light absorption properties (=?iso-8859-1?q?Kim=20San?=)
> 6. The Temperature of DRIE (Jia Zhou)
> 7. teflon coating (Satej Chaudhary)
> 8. Re: The Temperature of DRIE (tangyz)
> 9. RE: Si-to-Glass or Si-to-Si wafer bonding (Dr Robert Davis)
> 10. Re: Problems with MEM CAD, ETherm (Michael D Martin)
> 11. RE: mechanical solver (Dr Robert Davis)
>
> --__--__--
>
> Message: 1
> Date: Tue, 14 May 2002 15:50:43 -0700 (PDT)
> From: Wei Liang
> To: [email protected]
> Subject: [mems-talk] Help about MF-319 developer
> Reply-To: [email protected]
>
> Hello,
>
> I switch to SPR 3612 photoresist and MF-319 developer,
>
> but I don't have the data sheet for this developer. Is
>
> there any one familar with this developer? I don't
> even
> know whether I should dilute or not.
>
> Thanks.
>
> Best regards.
>
> Wei
> LAUNCH - Your Yahoo! Music Experience
> http://launch.yahoo.com
>
> --__--__--
>
> Message: 2
> Date: Wed, 15 May 2002 00:17:16 -0400
> From: "Michael D Martin"
> To:
> Subject: Re: [mems-talk] characterisation of multilayers
> Reply-To: [email protected]
>
> Elipsometry and Secondary Ion Mass Spectrometry
>
> -Mike
>
> >>> [email protected] 05/14/02 14:54 PM >>>
> Dear all,
> I have prepared multilayers of SiOxNy and MgF2 by
> electron beam physical vapor deposition technique.I
> would like to know different characterization methods
> of compositional and optical properties for these
> multilayers.
> Thanks in advance
>
> Yours
> K.C.Mohite
>
> =====
> **********************************************************
> K.C.Mohite Ph.9120-5695201(O)
> School Of Energy Studies 9120-7291872(R)
> Department of Physics
> University of Pune
> PUNE-411 007
> INDIA
> LAUNCH - Your Yahoo! Music Experience
> http://launch.yahoo.com
> _______________________________________________
> [email protected] mailing list: to unsubscribe or change your list
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> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.mems-exchange.org/
>
> --__--__--
>
> Message: 3
> Date: Wed, 15 May 2002 09:28:39 +0200 (CEST)
> From: =?iso-8859-1?q?sou=20zou?=
> To: [email protected]
> Subject: [mems-talk] Si-to-Glass or Si-to-Si wafer bonding
> Reply-To: [email protected]
>
> I am looking towards designing some MEMS devices (esp. torsional
> Micro-mirrors) using Hybrid flip chip technology. My concern is that I am
> still thinking about wheather I should use silicion on glass (Pyrex) or
> SI-to-SI bonding. Could you, please, help with advices such that the
> drawbacks and the advantages of every assembly, and how they could affect
> the properties of the components and their integration density ?
>
> Thank you everyone,
>
> Sofiane Zairi
>
>
>
> ---------------------------------
> Yahoo! Mail -- Une adresse @yahoo.fr gratuite et en frangais !
>
> --__--__--
>
> Message: 4
> Date: Wed, 15 May 2002 09:41:03 +0200 (CEST)
> From: =?iso-8859-1?q?sou=20zou?=
> To: [email protected]
> Subject: [mems-talk] mechanical solver
> Reply-To: [email protected]
>
> I heard that UTS compagny is selling a software package "TK solver, digitized
Roark's formulas, with a possibility of dynamic analysis". Did someone tried
this kind of package to advise me, if possible. If not what kind of equivalent
software or solver could help to obtain, such that, the relations between MEMS
sizes and their mechanical properties (Stiffness, strength).
>
> Thank you in anticipation,
>
> Sofiane
>
>
>
> ---------------------------------
> Yahoo! Mail -- Une adresse @yahoo.fr gratuite et en frangais !
>
> --__--__--
>
> Message: 5
> Date: Wed, 15 May 2002 17:38:44 +0800 (CST)
> From: =?iso-8859-1?q?Kim=20San?=
> To: [email protected]
> Subject: [mems-talk] SU8 light absorption properties
> Reply-To: [email protected]
>
> Hello,
>
> Can anyone provide me some information on SU8 light
> absorption / reflectance properties vs. wavelength?
>
> thanks & regards,
>
> Zhan Ping
> Yahoo! Kickin' Party - Win a 5-star getaway to exotic Bali!
> http://kickin.yahoo.com.sg
>
> --__--__--
>
> Message: 6
> Date: Wed, 15 May 2002 20:20:42 +0800
> From: Jia Zhou
> To: [email protected]
> Subject: [mems-talk] The Temperature of DRIE
> Reply-To: [email protected]
>
> Who knows the temperature in DRIE when silicon is deep-etched, say 500microns?
>
> Thanks.
>
> --__--__--
>
> Message: 7
> Date: Tue, 14 May 2002 18:29:14 -0700 (PDT)
> From: Satej Chaudhary
> To: [email protected]
> Subject: [mems-talk] teflon coating
> Reply-To: [email protected]
>
> Dupont is the spin on teflon supplier
> I have no experience with using it however.
> Satej
> LAUNCH - Your Yahoo! Music Experience
> http://launch.yahoo.com
>
> --__--__--
>
> Message: 8
> From: "tangyz"
> To:
> Subject: Re: [mems-talk] The Temperature of DRIE
> Date: Wed, 15 May 2002 21:46:54 +0800
> Reply-To: [email protected]
>
> Hi,
> STS confirms the temperature on the top of the wafer is below 60 degree.
> good luck
>
> ----- Original Message -----
> From: "Jia Zhou"
> To:
> Sent: Wednesday, May 15, 2002 8:20 PM
> Subject: [mems-talk] The Temperature of DRIE
>
>
> > Who knows the temperature in DRIE when silicon is deep-etched, say
500microns?
> >
> > Thanks.
> > _______________________________________________
> > [email protected] mailing list: to unsubscribe or change your list
> > options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> > Hosted by the MEMS Exchange, providers of MEMS processing services.
> > Visit us at http://www.mems-exchange.org/
>
> --__--__--
>
> Message: 9
> Date: Wed, 15 May 2002 14:44:45 UT
> From: "Dr Robert Davis"
> To: [email protected]
> Subject: RE: [mems-talk] Si-to-Glass or Si-to-Si wafer bonding
> Reply-To: [email protected]
>
> [demime could not interpret encoding binary - treating as plain text]
> Consider your requirements for the dimensions, requirements for a mirror may
depend on the wave length you are reflecting, note that using a glass frit you
will need to deal with the porosity and also consider the thermal properties of
the materials....you will need to process at an elevated temperature....
> Rob
>
> >----- Original Message -----
> >From: =?iso-8859-1?q?sou=20zou?=
> >
> >To: [email protected]
> >Sent: Wed, 15 May 2002 +0200 (CEST) 09:28:39
> >
> >I am looking towards designing some MEMS devices
> >(esp. torsional
> >Micro-mirrors) using Hybrid flip chip technology.
> >My concern is that I am
> >still thinking about wheather I should use silicion
> >on glass (Pyrex) or
> >SI-to-SI bonding. Could you, please, help with
> >advices such that the
> >drawbacks and the advantages of every assembly, and
> >how they could affect
> >the properties of the components and their
> >integration density ?
> >
> >Thank you everyone,
> >
> >Sofiane Zairi
> >
> >
> >
> >---------------------------------
> >Yahoo! Mail -- Une adresse @yahoo.fr gratuite et en
> >frangais !
> >_______________________________________________
> >[email protected] mailing list: to unsubscribe
> >or change your list
> >options, visit
> >Hosted by the MEMS Exchange, providers of MEMS
> >processing services.
> >Visit us at http://www.mems-exchange.org/
> >http://mail.mems-exchange.org/mailman/listinfo/mems
> >-talk
>
> --__--__--
>
> Message: 10
> Date: Wed, 15 May 2002 10:51:36 -0400
> From: "Michael D Martin"
> To: ,
> Subject: Re: [mems-talk] Problems with MEM CAD, ETherm
> Reply-To: [email protected]
>
> Hello,
> Yes, I have found the solution with the help of Coventor. Before I
> mention the cause, let me address your questions in case someone out
> there finds this useful.
>
> >user-specified heat flux, I have to guess that the heat flux off the
> >surfaces may be greater than the heat generated within the solid.
> This
>
> The surprising thing was that it appeared that heat was flowing out of
> the hotplate surface to the statically convecting (non-forced flow) air
> even though the temperature of the air was higher than the hotplate
> surface. This would be a violation of Fourier's law.
>
> >You say that the lower temperature appears BETWEEN the metal heater
> and
> >the holes. Does this occurs while the external surface temperatures
> are
> >above ambient?
>
> Temperatures below ambient occurred in a region between holes that
> perforate a nitride layer and a 25 micron wide Pt heater. This happened
> when the heater was actually above ambient.
>
> The problem turns out to have been caused by an incorrect material
> property. Specifically, the thermal conductivity of the nitride layer
> was 7 orders of magnitude too low. Of course, when I began the
> simulation I looked up these properties and had entered the correct
> values. At some point, perhaps while moving some of the files around, I
> must have changed the MPD (Material Properties Database) file I was
> using. In short the lesson is: Always check your material properties if
> your getting weird results even if your sure you have correct values.
>
>
> Thanks for the help Coventor!
> Mike Martin
>
>
> >>> Raj Gupta 05/14/02 08:27PM >>>
>
> Hi Michael,
>
> Have you found an answer to your problem? Not knowing exactly the
> boundary conditions you have set, specifically the emissivity and any
> user-specified heat flux, I have to guess that the heat flux off the
> surfaces may be greater than the heat generated within the solid.
> This
> can happen in reality, such as what causes dew formation on a car left
> outdoors overnight. One would guess for your situation, the reality
> is
> far from your simulated results.
>
> You say that the lower temperature appears BETWEEN the metal heater
> and
> the holes. Does this occurs while the external surface temperatures
> are
> above ambient?
>
> Are you using forced convection? Keep in mind that thermal
> conductivity
> to ambient through normal convection will scale with geometry.
> Reynold's number is much smaller on micron dimensions, and turbulent
> flow which can assist in forced convection will not be as efficient on
> smaller dimensions.
>
> Let me know how you manage to solve this problem. I am very curious.
>
> Regards,
> Raj
>
> Michael D Martin wrote:
>
> > Hi, Does anyone have experience with modeling hotplates or using
> the
> > ETherm module in MEM CAD? I am trying to model some hotplates with
> > meander type heaters and holes in them. The problem is that I keep
> > getting temps that are below the ambient temp that is set in a
> > convection-radiation boundary condition on the top and bottom of
> the
> > plate. The problem seems to occur between the metal heater and the
> holes
> > in a nitride support layer. Unfortunately, Coventor has NOT been
> too
> > helpful so far.
> >
> > Thanks,
> > Mike
>
>
> --
>
> Raj Gupta, Director
> Nanotechnology & MEMS Consulting
> 33 Vandewater Street
> Suite 205
> San Francisco, CA 94133-1967
> Website: http://www.mindspring.com/~rajgupta
>
> --__--__--
>
> Message: 11
> Date: Wed, 15 May 2002 14:53:16 UT
> From: "Dr Robert Davis"
> To: [email protected]
> Subject: RE: [mems-talk] mechanical solver
> Reply-To: [email protected]
>
> [demime could not interpret encoding binary - treating as plain text]
> Check with Failure Analysis Associates in the Palo Alto area...there are a
number of fracture mechanics codes...Rob
>
> >----- Original Message -----
> >From: =?iso-8859-1?q?sou=20zou?=
> >
> >To: [email protected]
> >Sent: Wed, 15 May 2002 +0200 (CEST) 09:41:03
> >
> >I heard that UTS compagny is selling a software
> >package "TK solver, digitized Roark's formulas,
> >with a possibility of dynamic analysis". Did
> >someone tried this kind of package to advise me, if
> >possible. If not what kind of equivalent software
> >or solver could help to obtain, such that, the
> >relations between MEMS sizes and their mechanical
> >properties (Stiffness, strength).
> >
> >Thank you in anticipation,
> >
> >Sofiane
> >
> >
> >
> >---------------------------------
> >Yahoo! Mail -- Une adresse @yahoo.fr gratuite et en
> >frangais !
> >_______________________________________________
> >[email protected] mailing list: to unsubscribe
> >or change your list
> >options, visit
> >Hosted by the MEMS Exchange, providers of MEMS
> >processing services.
> >Visit us at http://www.mems-exchange.org/
> >http://mail.mems-exchange.org/mailman/listinfo/mems
> >-talk
>
>
> --__--__--
>
> _______________________________________________
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>
>
> End of mems-talk Digest
