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MEMSnet Home: MEMS-Talk: DRIE etching of bulk silicon - comment
DRIE etching of bulk silicon - comment
2002-05-21
phil.lau@baesystems.com
2002-05-22
BERAUER,FRANK (HP-Singapore,ex7)
2002-05-23
Martin.WALKER@oxinst.co.uk
DRIE etching of bulk silicon - comment
Martin.WALKER@oxinst.co.uk
2002-05-23
Yes, it does look like Applied Materials are eyeing up the MEMS market.
They are currently offering deep silicon etching for trench isolation on
CMOS on their standard machines.  Applied Komatsu (the part of AM who make
equipment for the displays market) were present at the Las Vegas MEMS show
earlier this year, but not saying much.  Now we have heard about AM offering
heavy discount to a key research lab in the far east to buy a multi-chamber
system for photonics (waveguide dep and etch).  The brochure we have seen
also includes deep silicon using the Bosch process.  There are a number of
people in the equipment industry who are feeling distinctly nervous at the
moment!
Martin
>Does that mean APPLIED MATERIALS is planning a full frontal assault on the
MEMS Market in the near future?
>Look what happen to SPEEDFARM INC. and the CMP Market when APPLIED
MATERIALS nudged in. Phil
> -----Original Message----- From: Martin.WALKER@oxinst.co.uk Sent: 20 May
2002 12:33 To: mems-talk@memsnet.org  Subject:
RE:[mems-talk] DRIE etching of bulk silicon


Martin Walker B.Sc.(Tech.) M.Sc.
Tactical Marketing Engineer
Oxford Instruments Plasma Technology
North End, Yatton, Bristol, BS49 4AP UK
T.+44 (0)1934 837031  F.+44 (0)1934 837001
E. 
W. 


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