Vacuum Vapor Prime should work.  Bill moffat

-----Original Message-----
From: Kuo Wu Cheng [mailto:[email protected]]
Sent: Thursday, May 23, 2002 5:57 PM
To: [email protected]
Subject: [mems-talk] how to improve the adhesion between the SU8
structure and thesilicon wafer ?


Dear all:

         How to improve the adhesion between the SU8 structure and the
silicon
wafer while the wafer is put into the KOH solution doing
an anisotropic etching. I find the SU8 structure doesn't destruct but will
peel off from the wafer in the KOH etching.
         Thank you very much!

compilments

BagelKuo
_______________________________________________
[email protected] mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.mems-exchange.org/