Dear BagelKuo,

We found the same when etching in TMAH.
SU-8 adhered differently to different materials. Of the ones we tried,
it stuck worst to Au and best to SiN, Si (or native oxide) inbetween.
We don't use it as etch mask any more.
Microchem offers some adhesion promoter.

Greetings,
        Frank Berauer
        Senior R&D Engineer
        Hewlett-Packard Singapore


-----Original Message-----
From: Kuo Wu Cheng [mailto:BagelKuo@itri.org.tw]
Sent: Friday, May 24, 2002 8:57 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] how to improve the adhesion between the SU8
structure and the silicon wafer ?


Dear all:

         How to improve the adhesion between the SU8 structure and the
silicon
wafer while the wafer is put into the KOH solution doing
an anisotropic etching. I find the SU8 structure doesn't destruct but will
peel off from the wafer in the KOH etching.
         Thank you very much!

compilments

BagelKuo
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