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MEMSnet Home: MEMS-Talk: Re: Diaphragms via Wafer Bonding
Re: Diaphragms via Wafer Bonding
1996-02-10
Ash Parameswaran
1996-02-22
[email protected]
Re: Diaphragms via Wafer Bonding
Ash Parameswaran
1996-02-10
If you dope it with Boron, then it inrodues some tensile stress and it might
help stretch the thin membrane.

This technique is used by many US EPI/Etch-Stop wafer manufacturers for MEMS
applications.

Ash Parameswaran
Simon Fraser University


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