>and oxygen plasma but that still doesn't seem to fully take care of it
--
>some polymer still stays stuck in the deep narrow trenches.

Try increasing the pressure of the oxygen plasma to decrease the
radical's mean free path length. Then you might have better luck
cleaning those high apect ratio features.

-Mike


>>> smalek@samcointl.com 05/28/02 02:34PM >>>
SAMCO's UV-Ozone Cleaners might be able to help you with this
application.
Visit http://www.samcointl.com/prod/UVO.html for more information.

smalek@samcointl.com
--------------------------------------



Olgica Bakajin mems-talk@memsnet.org
Thu, 09 May 2002 10:40:19 -0700

What do you use to remove the teflon-like polymer (one of the most
inert
things there are!) that gets stuck on the wafer during some RIE
processes
(like the passivation layer in DRIE)? I have tried 3:1
sulphuric:peroxide
and oxygen plasma but that still doesn't seem to fully take care of it
--
some polymer still stays stuck in the deep narrow trenches. I need
something that would attack the flourocarbons but not damage the
silicon.
Any ideas would be appreciated.
--Olgica
Lawrence Livermore National Lab
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