Since PR ususally peels off in HF, is it possible that
you use metal layer as adhesion promoter or polySi
film as mask?

I ever HF etched pyrex using Ti+Cr+P.R as mask and it
had hold for more than 20 minutes before pin-holes
appeared.

This might be helpful:

Thierry Corman, J. Micromech. Microeng, 1998 8 84-87


jian


-----Original Message-----
From: Jing Liu [mailto:[email protected]]
Sent: Thursday, May 30, 2002 12:34 PM
To: [email protected]
Subject: [mems-talk] HF and photoresist mask



To who may concern,


I want to mask HF etching with photoresist. Just now,
somebody suggest me
that
for the same thickness of oxide I will etch. The
photoresist could stand
buffered HF, but for concentrated HF, it will not. Is
it exactly the case?
Could I be able to find some reference?


BTW, we have Shipley 1813, AZ 5214, Az 9245 in the
lab. Does anyone have some
date of how fast they will etched in HF?


Thanks,


Jing
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