Martin,
       Straight Oxygen plasma can remove hard baked Polymide.  One of our
customers is removing 8 microns of Polymide in less than 5 minutes.  Your
problem may be in not getting under the nitride member.  Plasma is a line of
sight animal and can not penetrate to far under a shelf.   We developed a
system for one of our customers a few years ago where we had to sweep under a
16 micro table with only a 1 micron gap to work with.  For this we introduced
some horizontal component in the gas flow to sweep under this table.  If you
want to test this let me know.  Bill Moffat

-----Original Message-----
From: Martin HEDSTROM [mailto:[email protected]]
Sent: Wednesday, June 05, 2002 8:14 AM
To: [email protected]
Subject: [mems-talk] Polyimide residue removal


Hi all,

I have a problem with removal of polyimide residues under a nitride
membrane. The polyimide is removed in a pure O2-plasma since I am afraid
that any CF4 addition might hurt the nitride membrane. Apparently this
O2-plasma is not sufficient since I get small residues left with about
100-500 nm thickness.

Does anybody know about any dry etchant which can remove the last of the
polyimide without damaging the nitride membrane?


Thanks in advance

/Martin
_______________________________________________
[email protected] mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/