You might look at UV release dicing tape.  It will resist strong HF
solutions, and after a flood UV exposure has very little "tack" or
stickiness

Mac McReynolds
R&D Manager
Caliper Technologies Corp.
605 Fairchild Drive
Mountain View, CA 94043-2234
Tel:  650-623-0710
Fax:  650-623-0521

> ----------
> From:         Roger Shile
> Reply To:     [email protected]
> Sent:         Wednesday, June 5, 2002 5:06 PM
> To:   [email protected]
> Subject:      [mems-talk] backside protection
>
> I am looking for a tape to put on the backside of 100 mm Si wafers to
> preserve
> the oxide on the back, while etching the front in buffered oxide etch.
>
> I have seen this done using dicing tape.  A coworker told me about
> something
> called "Yellow Tape" that came in circular pieces the same size as the
> wafer,
> apparently made for this purpose.  After use, the Yellow Tape was removed
> with
> acetone, which would be an advantage over peeling dicing tape from
> delicate
> substrates.
>
> Could someone refer me to a source for this Yellow Tape or suggest an
> alternative?
>
> Roger Shile
>
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