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MEMSnet Home: MEMS-Talk: Protecting die during wet chemical etching
Protecting die during wet chemical etching
2002-06-07
Derek Strembicke
2002-06-10
___
2002-06-10
Michael D Martin
2002-06-10
Michael Yakimov
Protecting die during wet chemical etching
Michael Yakimov
2002-06-10
Derek,

We are using a Crystalbond 509 glue from Aremco (www.aremco.com) for similar
purpose. I guess it can stand the conditions you described. It's a plastic
with melting point  of ~130C, which can be applied directly to a hot glass,
or you can dissolve it in acetone and spray on the substrate (although I
never tried sprayting). It can be nicely removed by acetone or photoresist
remover (we use 1165)

Mike



> -----Original Message-----
> From: Derek Strembicke [SMTP:strem@knology.net]
> Sent: Friday, June 07, 2002 5:04 PM
> To:   mems-talk@memsnet.org
> Subject:      [mems-talk] Protecting die during wet chemical etching
>
> Hi Everyone,
>
> I'm interested in determining how people protect the side and back of die
> during wet chemical etching (TMAH or KOH specifically). As you know this
> is
> usu. carried out at 80C and the desire is to have an inert material that
> will not effect the chemistry of the etch. It also has to allow for
> multiple
> die, ease of handling, and post-etch die removal.

reply
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