We have been using various ratios of the "standard" isotropic silicon etch
(HF-HNO3-acetic acid) for deep etching of silicon. A haze often develops
in apparently random places on the etched surface. The haze is due to a
fine (~1 micron) texture that develops on the surface. Can anyone suggest
a cause and/or remedy for this haze?

Shifang Zhou
Microelectronics Research Center
New Jersey Institute of Technology