Hello Folks,

Could anyone give comparison between Au-Si bonding and Al-Si bonding on
wafer level?  I have seen many people do Au-Si bonding but not many  do
Al-Si bonding.  Besides Al-Si eutectic temperature is higher than Au-Si,
what else reason makes it not as popular as Au-Si?  Bonding strength?

I would think Al is IC compatible and it is much easier to process in an IC
fab.  Any comment is highly valued.  If one can tell me some reference
papers talking about Al-Si bonding, that will be very much appreciated.

Regards,
Yahong

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