Dear All

I am depositing gold on a polyimide circuit to
wirebond to a package but bond pad is not connected
(reason may be that ultrsonic energy is transferred to
polyimide surface)and there is no contact.  I don't
know.  Can u Please help me in solving this problem or
suggesting to make some other arrangement to connect
the circuit on polyimide to some external package.

Thanks

M. Aslam
[email protected]
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