Hi:
I am new to ebeam technology but have a MEMs application where I'd like to
use ebeam lithography. I'd like to define a pattern about a micron wide at
the narrowest  point, develop it by wet developer, then do some metal
depositions and then remove the resist by a thermal treatment instead of by
a wet lift off step. In fact I need to avoid any chemical treatment at this
stage because of a sensitive material layer. Thermal stability of all
material layers is, however, no problem. I've heard of some burn-off type
resists but don't know the details.  I think PMMA doesn't quite burn off
completely.  Can anyone suggest anything?

Thank you,
 Gareth Hougham
(914) 945-1946