Hi Kousik,

EV (Austria) and Karl Suss (Germany) and probably a few others make
backside mask aligners. UTS (USA) makes a backside stepper.
If you etch through from the front side, you may not need backside
alignment. But then backside processing on a wfare with holes will
be tricky.

Greetings,
        Frank Berauer
        Senior R&D Engineer
        Hewlett-Packard Singapore


-----Original Message-----
From: Kousik Sivakumar [mailto:[email protected]]
Sent: Friday, August 23, 2002 4:19 PM
To: [email protected]
Subject: [mems-talk] Lithography alignment for front and back side of
wafer


Hi,
I am trying to get a through-hole in a Si wafer. I would like to know how
to perform alignment for the front and back side of a wafer. I have not
been able to align the two squares on either side of the wafer accurately.
Any suggestion regarding this will be really helpful.
Any suggestion for forming a through-hole without having to make two
squares on either side of the wafer will also be helpful.
Thanks

Kousik Sivakumar
Graduate student
Department of ECE
University of Delaware
Home: 302-737-5232
E-mail: [email protected]
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