Rob,

Contact Robert Smith at K&S in PA excellent source
for information and saw technology. If it can be done
he'll know how.

215 784 6533

avi


Message: 5
From: "RobDavis" 
To: 
Date: Thu, 5 Sep 2002 08:02:36 -0700
Subject: [mems-talk] Wafer saw modifications
Reply-To: mems-talk@memsnet.org


Want to modify K&E wafer saw to cut thicker wafer, bonded material.  Any
clue how thick the substrate can be?  Can I take the cut up to the
reinforcement ring for the blade?  Any ideas on diamond blade cost and
supplier?
Thanks
Rob





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