Rob,
What type of wafer is it? (Silicon)
What is the max thickness you will need to cut and the kerf width you need?


-----Original Message-----
From: Avi.Laker@teccor.com [mailto:Avi.Laker@teccor.com]
Sent: Thursday, September 05, 2002 12:29 PM
To: mems-talk@memsnet.org
Cc: rhsmith@kns.com
Subject: K&S SAW MODIFICATION - MEMS-talk digest, Vol 1 #392 - 5 msgs






Rob,

Contact Robert Smith at K&S in PA excellent source
for information and saw technology. If it can be done
he'll know how.

215 784 6533

avi


Message: 5
From: "RobDavis" 
To: 
Date: Thu, 5 Sep 2002 08:02:36 -0700
Subject: [mems-talk] Wafer saw modifications
Reply-To: mems-talk@memsnet.org


Want to modify K&E wafer saw to cut thicker wafer, bonded material.  Any
clue how thick the substrate can be?  Can I take the cut up to the
reinforcement ring for the blade?  Any ideas on diamond blade cost and
supplier?
Thanks
Rob





--__--__--

_______________________________________________
MEMS-talk mailing list
MEMS-talk@memsnet.org
http://mail.mems-exchange.org/mailman/listinfo/mems-talk


End of MEMS-talk Digest