The Au layer act as a mirror so roughening it might defect the purpose.
Will oxygen plasma clean be good enough for anodic bonding?
Thank you for your help!
Phyllis Yuen
UC Davis
 [email protected] wrote: > I would like to bond Si and pyrex wafer
together by anodic
> bonding. My Si wafer has some trenches which the bottom is
> covered by a 200A Cr/ 500A Au. How can I clean this Si wafer
> before anodic bonding? Can I do RCA SC1 clean
> (water+H2O2+Ammonia solution) to remove organic
> contaminations, without the RCA SC2 clean (water+H2O2+HCl),
> which remove the metallic contaminations?

You can do a Piranha clean (H2SO4 + H2O2, 120 C) for 5 minutes.
In our experiments with different gold samples (with chromium adhesion layer),
one was not etched at all and the other was roughened slightly.

--Kirt Williams Agilent Technologies




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