Hello,

We develop packaging for MEMS devices, including component level vacuum
packaging.  Among other equipment, we have an HP4000 flipchip bonder for
component placement, an SST Model 3150 high vacuum programmable furnace for
vacuum sealing, and X-ray and acoustic microscopy for inspection.  A more
thorough description of our capabilities can be found at my web site, as
listed below.  Please contact me if we can be of assistance.

Sincerely,

Robert Dean

Research Associate IV
Center for Advanced Vehicle Electronics
Auburn University
200 Broun Hall
Auburn, AL 36849

Voice: 334-844-1838
Fax:   334-844-1898
Email: [email protected]
Web: http://www.eng.auburn.edu/~rdean