Dear Dlee Li,

I´m applications engineer responsible for bonding at Suss MicroTec. SUSS
MicroTec is a worldwide manufacturer and supplier of precision
microelectronics equipment for the manufacturing and R&D environments. These
include Mask Aligners, Bonders, Flip Chip Bonders, Spin Coaters and Probe
Systems for the MEMS, advanced packaging and semiconductor markets.
We can offer:
- Applications center
- Demo compatibility
- Close contact to MPI + FHG
- Process development support
- SOI bonding
- Low temperature bonding
- Eutectic bonding
- Direct bonding
- Anodic bonding
- Thermal compression bonding
- Laser pre-bonding


We can make an offer of service to bond you substrates, but we need more
informations about your process. What do you want to do exactly? Do you use
an adhesive to bond your substrates or something else? You see I need more
informations.

Best Regards,
Margarete Zoberbier
--------------------------------------------
SUSS MicroTec
Applications Center Europe
Margarete Zoberbier
Schleissheimer Str. 90
85748 Garching
Germany
Phone   +49 89 32007 - 380
Fax     +49 89 32007 - 390
email   [email protected]

Message: 9
From: "Dlee Li" 
To: [email protected]
Date: Fri, 11 Oct 2002 22:43:12 +0000
Subject: [mems-talk] glass-glass bonding service
Reply-To: [email protected]

hi, mems researchers
I am looking for glass-glass bonding services. My material is Pyrex7740.If
you have such kind of information, please let me know.

thanks in advances!
Dlee