I haven't done much gold bonding myself, but there's a bonder in our lab
that we use. The obvious thing, that you haven't mentioned is heat. Are
you heating your sample?

Jesse Fowler
  UCLA/MAE Dept., 420 Westwood Plaza, Room 37-129, ENGR IV
  Los Angeles, CA 90095-1597 | (310)825-3977
"Never worry again about the quality of your random numbers!"
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On Mon, 21 Oct 2002, Chiatti O wrote:

> I have the following problem:
>
> I have have an AlGaAs/GaAs chip (a.k.a. HEMT) with Au/Ge/Ni ohmics
> and Au gates. The ohmics are covered by a thin layer of what seems
> to be gold.
> I am supposed to bond gold wires to the ohmics and the gates using
> a wedge bonder.
> The first time I tried, everything was fine.
> The second time, with the same kind of chip and the same processing,
> the gold wires do not stick to the ohmics, no matter how often I try.
>
> Has anyone an idea of what is going on?
>
>
> Olivio Chiatti
> Royal Holloway University of London
> o.chiatti@rhul.ac.uk
>
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