Hi, everyone,
We are using Cyantek ( 78% phosphoric acid, 14% acetic acid, 8% nitric acid to
etch 400 nm Moly on
glass substrate. The procedure is put panels into acid first followed by a quick
dump into DI water.
We found that during etching, lots of bubbles are generated and after quick dump
there will be some
streaky patterns. As a result, some Mo parts see more undercut. Usually the thin
line have more
undercut compared with big pad.
My questions:
1. What is in the bubble? The effect of bubble is due to galvanic reaction?
2. Any better Mo etchant to have less bubble generations?
3. Anyone saw this before? and how to solve this problem?
Thanks.
Yun
g GE Global Research Center
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Yun Li, Ph.D
KWB405, Thin Films Lab
Micro and Nano Structures Technology
One Research Circle, Niskayuna, NY 12309
* (518) 387 - 6134, DC: 8*833 - 6134
> * (518) 387 - 6030, DC 8*833 - 6030
* [email protected]
