You might try a very brief electroplate of nickel to put down a seed layer.

David Nemeth
Senior Process Engineer
Sophia Wireless, Inc.
14225-C Sullyfield Circle
Chantilly, VA
Ph: (703) 961-9573 x206
Fax:(703) 961-9576

-----Original Message-----
From: [email protected] [mailto:[email protected]]On
Behalf Of Peter & Judy Wright
Sent: Wednesday, October 30, 2002 12:36 AM
To: [email protected]
Subject: [mems-talk] Electroless Ni on Au


Is it possible to plate electroless Ni on Au? I have exposed gold pads, in
openings in a silicon nitride passivation layer, which I want to bump. I
would like to use Ni as the UBM and electroless deposition would save me a
photolithography step. If it is possible, what is the chemistry that is
required to catalyze the reaction and will the Ni film adhere well to the
Au?

Thanks for any help.
Peter Wright
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