Re: removing AZ4562 photoresist after exposure to CF4 plasma
lakshmikanth namburi
2002-10-30
32 min definetely seems too long. You are making teflon out of your resist. Its
getting too hot.
It should not take more than a couple of min to etch silicon nitride. If you
chamber is not
cleaned for a while and has lot of organics, that could be slowing down the
etch rate. If you
keep the etch time low, you will have no problems.
You may also try using SF6 or NF3 instead of CF4 to lower the etch time.
-Lakshmi Namburi
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