Hello everyone,
I am Electroplating 15 um of Au on top of .5 um of sputtered Au and I have the
folowing prob: the electroplated Au is very porous and its surface is kindda
rough. I am using both, pure gold and gold with 20% tin, but the results are not
much difference. The plating current is pretty low and these are buffered
solutions that I am using. Can anyone shed a light on this prob? beside SU8,
what are other photoresists that I should experiment with?
Thanx




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