Yours is a very good question. I have been told that even though vapor etching
of oxide is easily accomplished that a water rinse is probably necessary after
etching to remove trace amounts of HF on the surface of the device. If not
rinsed it can cause corrosion later on after the device has been packaged. So I
believe you would need to rinse then do a critical CO2 dry or some other method
that reduces stiction. Bob Henderson