Hello,
For a special optical device I'm fabricating,
after depositing a 12µm thick SiO2 top cladding
(with plasma CVD) around a
6µm X 6µm Ge-doped SiO2 waveguide core, I would need
to mechanically planarise the top surface until I expose again
the top side of the core.
The substrate is a 4'' wafer.
The accuracy I would need on the planarisation depth
is very high, it should be
better than +/-1µm, and of course the surface should
not become too rough, otherwise the optical losses due
to light scattering would increase too much.
If someone of you has a polishing machine who can do this
job I would be very interested.
Best Regards
Matteo Dainese