3d chip integration (packaging), interconnection and housing in one step
Andrea Reinhardt
2002-11-22
To everybody interested in using this new technology (3D-CSP) which will not
require any classical bonding and offers more possibilities in making the
components as small as possible, we will send a PowerPoint presentation for free
(in print or on cd), please just forward your mail address
Regards
Andrea
----- Original Message -----
From: Richard Morrison
To: [email protected]
Sent: Friday, November 22, 2002 6:15 PM
Subject: [mems-talk] Shadow Mask
Call Photo Sciences they have made Shadow mask they are excellent, Tel#
310-784-7460
Rick
Rick Morrison
Sr. Semiconductor Engineer
Radant Mems Inc.
255 Hudson Road
Stow Ma, 01775
Tel- 978-562-3866
Cell 508-801-4796
AMS Phone: 508-770-3521
EMAIL [email protected]
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