Kevin,
Oxygen plasma burns it off at about the same speed as PR. Also, you may be
able to peel it off, depending on the thickness, and on what it's coated.

Jesse Fowler
  UCLA/MAE Dept., 420 Westwood Plaza, Room 37-129, ENGR IV
  Los Angeles, CA 90095-1597 | (310)825-3977
"Never worry again about the quality of your random numbers!"
    -- Advertisement

On Tue, 3 Dec 2002, Sang (Kevin) Kim wrote:

>
>
> Quick question with using Parylene -
> Is there an easy way to lift or remove Parylene?
>
> Thanks,
> Kevin
>
>
> -----Original Message-----
> From: [email protected]
> [mailto:[email protected]]On Behalf Of Matthieu Liger
> Sent: Friday, November 29, 2002 5:19 PM
> To: General MEMS discussion
> Subject: Re: [mems-talk] Can parylene resist the attack of KOH andTMAH?
>
>
> Hi,
>
> I did something like that before. Parylene will not be attacked by the
> KOH but the parylene/silicon interface will be. From what I oberved,
> Parylene/SiO2 interface was fine, so what you can do is have a silicon
> dioxide "ring" underneath the parylene on the edge of the frontside. If
> you are etching through the whole thickness and don't have oxide on the
> frontside, the KOH will start to attack the interface (really fast,
> about 1mm in 10 minutes). What you can do it stop the KOH etching before
> the silicon (say when there's 10 microns left) is competely gone and
> finish the etching with gas-phase of plasma etching.
>
> Matthieu
>
> Gang Li wrote:
>
> >Dear all,
> >
> >Can parylene be used to protect frontside of the wafers when
> >you carry on etching trough the wafers from the backside?
> >Any information will be appreciated greatly.
> >
> >Regards,
> >
> >Li Gang
> >
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> >
> >
> >.
> >
> >
> >
>
>
>
>
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