Dear all,
has somebody ever experienced adhesion problems of SU8 (2000 series, 15
- 20 micrometer thick) on electroplated Cu or Au substrate AFTER post
exposure bake?
And maybe any idea how to cope with it, or what the reasons might be?
We never had these problems with the "old" series, and actually, with
the new series, adhesion properties are supposed to be even better
(according to microchem's website).
I am very glad to receive your comments!
thanks,
mona
--
Mona Klein
Tabata Lab
Ritsumeikan-daigaku
Rikogu-bu
Noji-Higashi 1-1
525-8577 Kusatsu-shi
Japan
Email: [email protected]
Phone: +81-(0)77-566-1111
URL: http://www.ritsumei.ac.jp/se/~tabata/
