Dear Mr. Foo,

Yes we do have a tool for non contact gentle cleaning of wafers that can
remove particles down to 0.05 micron. It is not a high pressure
cleaning. DI water passes through a nozzle picking up megasonic energy
and transfers to the wafer surface through the water column which is
scanned over the rotating wafer to deliver uniform cleaning. Being
megasonic it does not suffer from cavitation (micro explosion) effect;
it dislodges particles by momentum transfer. Furthermore power can be
reduced arbitrarily from maximum of 60W on about 0.5 cm2 area to clean
as gently as desired. Then the particles suspended in DI water are
removed with high speed spinning or through centrifugal force. This
technique can be combined with a chemical dispense cycle for chemical
cleaning, or cleaning can be helped by dispensing surfactant. Including
IPA/N2 dry it allows dry wafer in and dry wafer out.

For further information you can call me at 512 385 4552 or check our web
page nanomaster.com.

Best Regards,

Birol Kuyel, Ph.D.

-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of foo foo
Sent: Wednesday, December 18, 2002 3:41 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] cleaning wafers


Dear all

I have a general question concerning Si-wafer cleaning. Is there any
gentle
way to remove small particles, especially Si-particles, from a Si wafer?


Patrick




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